eYs3D Microelectronics钰立微电子

3D stereo-depth camera modules and multi-sensor controller ICs (eSP936, YX9170, YX9670) for AMRs, service robots and unmanned vehicles, plus a jointly-branded 'Robotics Subsystem Platform' (AMR01C/AMR01M) combining eYs3D sensing with parent Etron Technology's XINK edge-compute boards -- unveiled at CES 2026 with no disclosed revenue, customer, or shipment figures.

面向 AMR、服务机器人与无人载具的 3D 立体深度摄像模组与多传感器控制器芯片（eSP936、YX9170、YX9670），并与母公司钰创科技联合推出“机器人子系统平台”（AMR01C / AMR01M），整合 eYs3D 感知模组与钰创 XINK 边缘运算板卡——于 CES 2026 首度发布，未披露任何营收、客户或出货数字。

PROVISIONAL — NOT VERIFIED待定条目 — 未经核验

This record is provisional.本条目为待定状态。 It hasn't been through the checks the rest of the map has, so it carries no source references or diligence score, and the index won't hold it. The blockers below say what would have to change. 它还没走完地图其余部分都走过的核验流程，所以没有来源引用，也没有尽调评分，指数不会持有它。下面的阻塞项写着要先解决什么。

What it does3D stereo-depth camera modules and multi-sensor controller ICs (eSP936, YX9170, YX9670) for AMRs, service robots and unmanned vehicles, plus a jointly-branded 'Robotics Subsystem Platform' (AMR01C/AMR01M) combining eYs3D sensing with parent Etron Technology's XINK edge-compute boards -- unveiled at CES 2026 with no disclosed revenue, customer, or shipment figures.

在干什么面向 AMR、服务机器人与无人载具的 3D 立体深度摄像模组与多传感器控制器芯片（eSP936、YX9170、YX9670），并与母公司钰创科技联合推出“机器人子系统平台”（AMR01C / AMR01M），整合 eYs3D 感知模组与钰创 XINK 边缘运算板卡——于 CES 2026 首度发布，未披露任何营收、客户或出货数字。

Why it mattersTaiwan's stated strength is semiconductors and precision electronics, and eYs3D is the cleanest expression of that strength inside P01 (multimodal sensing and calibration): a Taiwan-designed stereo-depth-camera-plus-controller-IC stack, spun out of a Hsinchu-based, Taipei Exchange-listed parent (Etron Technology, TPEx 5351), now packaged specifically as a robotics sensing subsystem (G120/G100/G62 depth cameras feeding SLAM, obstacle avoidance, object detection and tracking) rather than as a generic camera-module supplier. The YX9170/YX9670 lines are explicitly marketed for 'industrial and service robots and autonomous vehicles,' which is a narrower and more direct P01 claim than most sensor vendors make.

为何重要台湾的既有优势在半导体与精密电子，而 eYs3D 是这一优势在 P01（多模态感知与标定）领域最直接的体现：由新竹、台湾创柜板上市母公司钰创科技（5351.TWO）孵化的立体深度摄像头加控制器芯片方案，如今已明确打包为机器人感知子系统（G120/G100/G62 深度摄像头，支持 SLAM、避障、物体检测与追踪），而非泛用型摄像模组供应商。YX9170/YX9670 产品线明确面向“工业与服务机器人及无人载具”，这一定位比多数传感器厂商的表述更聚焦于 P01。

Caveat

Everything found in this research pass is a product announcement, not a disclosed business. The AMR01C/AMR01M 'Robotics Subsystem Platform' was unveiled 2025-12-18 for CES 2026 (Jan 6-9, 2026) with no revenue, shipment, unit-price, or named-customer figures anywhere in the primary release -- it reads as a reference design intended to attract integrators, not a shipping product line with disclosed volume. eYs3D itself is not separately listed: it was spun off from Etron Technology in 2016 and its own website describes itself as 'Powered by' Etron, but the exact ownership percentage Etron still holds was not confirmed in this pass, and eYs3D discloses no financials of its own (public or private).

Etron Technology, the TPEx-listed parent, posted extraordinary revenue growth in 2026 (July 2026 consolidated sales NT$2,125m, +590.83% YoY; Jan-Jul 2026 NT$9,759m, +481.09% YoY, per Etron's own monthly filings) -- but Etron's own disclosures give no segment breakdown, and nothing found here attributes that surge to robotics rather than Etron's core DRAM/IC design business, which is the far larger and longer-established line. Do not read Etron's headline growth as a robotics number; no robotics revenue is broken out at either the eYs3D or Etron level.

风险提示

本轮研究找到的一切均为产品发布，而非已披露的业务。AMR01C / AMR01M“机器人子系统平台”于 2025-12-18 为 CES 2026（2026 年 1 月 6-9 日）发布，官方新闻稿中未披露任何营收、出货量、单价或具名客户数字——更像是面向系统集成商的参考设计，而非已有披露出货量的量产产品线。

eYs3D 本身未单独上市：2016 年自钰创科技分拆，其官网自称“Powered by”钰创，但钰创目前实际持股比例本轮未能核实，且 eYs3D 未披露任何自身财务数据（无论公开或私募层面）。母公司、创柜板上市的钰创科技 2026 年营收增长极为剧烈（2026 年 7 月合并营收 21.25 亿元新台币，同比 +590.83%；1-7 月合计 97.59 亿元新台币，同比 +481.09%，均出自钰创自身月度公告）——但钰创的公告未给出任何分部拆分，本轮研究也未发现任何证据将这一增长归因于机器人业务，而非钰创规模更大、历史更久的核心 DRAM／IC 设计业务。

不应将钰创的整体营收增长误读为机器人业务数字；无论是 eYs3D 还是钰创层面，均未单独披露机器人相关营收。

Bottlenecks瓶颈 P01 Multimodal sensing & calibration多模态传感与标定

Proposed for: companies
Class: private
Country: TW
HQ: Hsinchu, Taiwan
Ticker confidence: confirmed
Systems: senses
Evidence: [object Object] · [object Object] · [object Object] · [object Object] · [object Object]
Proposed by: tw-8-systems-research
Confidence: 40
Translated fields: title_zh · summary_zh · what_it_does_zh · why_it_matters_zh · caveat_zh